IXYS BiMOSFETs Series 3000V Surface Mount Power Device (SMPD) Packages are an expansion of the ISOPLUS™ package portfolio that include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines. The SMPD range provides a large array of standard options in terms of topology or silicon varieties. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines.
Features
Ultra-low and compact package profileSurface mountable via standard reflow processLow package weightUp to 4500V ceramic isolation (DCB)
